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    Startseite/Events-tutorials/Artikel
    Surfx Technologies to showcase flux-free flip chip, hybrid wafer bonding tech
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    Events-tutorials

    Surfx Technologies to showcase flux-free flip chip, hybrid wafer bonding tech

    SurfX Technologies will be focusing on its revolutionary flux-free flip chip and hybrid wafer bonding technologies at this year’s Productronica event,
    Veröffentlicht
    19. Oktober 2023
    Lesezeit
    1 Minute
    Rubrik
    Events-tutorials

    Novel-Technology Transfer, B1.916

    Visit the Novel-Technology Transfer booth to see Surfx Technologies‘ flagship product, the STA-10iL automated plasma machine, in action. This machine is configured for cleaning and oxide removal from 300mm wafers. Live demonstrations will highlight the effectiveness of the machine in providing flux-free cleaning solutions for semiconductor wafers.

    A video reel will also be presented, showcasing the STW wafer cleaning tool and various Atmospheric Argon Plasma cleaning applications tailored to the semiconductor industry. This multimedia presentation will provide attendees with a comprehensive understanding of the wide-ranging capabilities in surface treatment.

    Bentec, A3.120

    Bentec will have dedicated a section of its booth to showcasing Surfx’s Atomflo atmospheric surface plasma treatment technology.

    “We are excited to be part of productronica 2023 and to have the opportunity to showcase our flux-free flip chip and hybrid wafer bonding technologies,” said Robert Hicks, President & CEO at Surfx Technologies. “Our presence at this event reflects our dedication to advancing semiconductor manufacturing processes and providing our customers with the most reliable and effective surface treatment solutions.”

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