Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Products/Artikel
    Surface-mount equipment and software tools joined total line solution
    Bildquelle nicht angegeben
    Products

    Surface-mount equipment and software tools joined total line solution

    At SMTconnect 2019, Yamaha Motor Europe SMT Section revealed more details of new surface-mount equipment and software tools joining their Total line
    Veröffentlicht
    20. Mai 2019
    Lesezeit
    2 Minuten
    Rubrik
    Products

    “Europe’s high-tech sector is extremely active right now and we met many visitors engaged in ongoing projects seeking solutions to specific challenges,” commented Mr. Ichiro Arimoto. “We introduced important innovations throughout our Total line solution that are designed to overcome the challenges they are facing.”

    The company’s latest equipment line-up now adds the YSP10 screen printer with next-generation automated features. Seen for the first time in Europe at the show, the screen printer eliminates human intervention from product changeovers by automatically changing the program, stencil, and support pins and recovering unused solder paste. Technical specialists showed how this advanced automation cuts changeover time from several minutes to about 70 seconds. 510 mm x 510 mm maximum board size tackles today’s toughest challenges, such as large display-backlight panels and industrial boards.

    Alongside the YSP10, the company also showcased the latest in high-speed mounting with the enhanced YSM20R. Introducing 0201-chip component-placement capability, it also delivers a 5 % speed boost leveraging faster X-Y axis speeds. Further innovations include fully automated feeder and tray exchange that cut downtime during changeovers or replenishment to the bare minimum.

    With the latest YSi-SP, dedicated to solder-paste inspection, the company’s 3D-vision expertise further enhances quality assurance. Advanced features include proprietary high-speed vision algorithms and selective super-high resolution to tackle challenging areas containing small or densely-spaced pads.

    In addition, enhancements to the YSi-V post-placement AOI system include a full-HD LCD touch panel with enhanced navigation to maximise the combination of the YSi-V’s12Mpixel camera and image-capture technology for super-accurate inspection capability.

    Visitors also discovered two new features of the Factory Tools 4.0 software suite. The powerful new dashboard shows current status and historical line data with depth and clarity, while the Image Viewer greatly accelerates visual analysis and troubleshooting. By simply clicking on a dashboard item, users can call up digital images from any camera onboard the printer, mounters, SPI and AOI in each line.

    Completing the enhancements presented at the show, upgrades to the YST15 intelligent component-storage system enhance job preparation with new automated features that assist program optimisation and reserve needed components in inventory.

    www.yamaha-motor-im.eu

    Mehr aus Products

    Weitere aktuelle Artikel aus der Rubrik Products.

    Alle Products-Artikel
    Heavy board options added to reflow soldering system
    Products

    Heavy board options added to reflow soldering system

    27. Mai 2025

    Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This

    New 3D AXI platform provides clearer imaging
    Products

    New 3D AXI platform provides clearer imaging

    22. Januar 2025

    Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer

    No-clean formula maximize the solderability
    Products

    No-clean formula maximize the solderability

    10. Januar 2025

    Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting

    Extensive program of testing options
    Products

    Extensive program of testing options

    10. Januar 2025

    Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and

    ← Zurück zu ProductsZur Startseite