StratEdge Corporation, manufacturer of high frequency and high power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces the expansion of its Assembly Services Division and its facilities and capabilities for packaging RF and microwave devices that range from DC to 63 + GHz. Assembly services cover the gamut of packaging, from manual to fully automatic and first article prototypes to hundreds of thousands of modules for fully automated production.
The company’s ISO 9001:2015 facility has a Class 1000 cleanroom and Class 100 work area with workstations for performing sensitive operations. It is fully furnished with the most modern assembly equipment for high-speed fine wire wedge and ribbon bonding. The bonder is equipped for eutectic gold-tin (AuSn) attachment of devices, achieving bond line thickness less than 6 µm. Their proprietary eutectic die attach technology has been honed to get the best possible power output for gallium nitride (GaN) devices and results in lower junction temperatures and increased device reliability.
The Assembly Services Division specializes in:
- RF and microwave devices, including GaN and gallium arsenide (GaAs)
- High-frequency passive and active components
- Multiple component multi-chip modules
- Power amplifiers, low noise amplifiers, mixed signal devices
Their capabilities include:
- Epoxy and eutectic die attach
- Automated gold-tin die attach developed for GaN and GaAs devices
- Automatic and manual wedge wire bonding
- Ribbon bonding
- Low profile wire bonds
- 50-ohm lines for reducing wire lengths
- Conductive and non-conductive epoxies
- Full packaging as well as chip-on-tab where heat spreading tabs are provided
„Flexible equipment, skilled operators, and experienced applications engineers enable StratEdge to accommodate the numerous needs of our customers,“ said Casey Krawiec, VP global sales. „Our new die attach system is the fastest and most reliable multiple die-type bonder on the market and the automated eutectic die attach vastly increases throughput. When chips are assembled in our high-frequency or high-power packages, they will perform to their fullest potential.“
