Displayed at the booth will be PI, the SPI system that has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems. PI’s 360° Moiré technology, offers a unique review image and outstanding performance through unambiguous Z referencing and compensation.
It is the only inspection system to program automatically, therefore inspection quality is not reliant on the training of the programmer. Being the new SPI generation, Pi is fully connectable and provides solutions to improve processes. Combined with Sigma Link and AOI solutions, Pi enables the user to improve processes through a complete analysis of the solder joints versus solder paste deposit. Pi also is compatible with all major printers.
Also on display will be the 5K Series which offers flexibility for wider board applications and benefits from all the latest innovations, including selective 3D AOI technology for accurate tilt and coplanarity measurement of ICs, connectors and passive components if 3D inspection of specific parameters is required. The series also provides enhanced color viewing on the defect viewer station to facilitate operator repair jobs.
The innovative and modular concept of the 5K Series allows companies requiring entry-level or mid-range AOI systems to upgrade their equipment on-site to meet future requirements. The series has been designed with best-in-class hardware and software technologies to provide accuracy and repeatability and a short cycle time.
Finally, Sigma Review is a new web-based multi-step multi-line review software that will be highlighted at the show. By displaying & correlating both SPI and AOI data and images, including reference images, Sigma Review opens the way to defect root cause analysis. Predefined IPC defect categories offer a simple and robust classification environment. Based on the classified defects, Sigma Review can suggest corrective actions for the operator. Sigma Analysis is a new web-based real-time yield analysis software that offers powerful data mining solutions and drill down analysis.
