With its new Modula Wave wave soldering system, Kirsten Soldering AG has produced a major prerequisite for a high-quality, energy-saving soldering system. The compact design means that Siemens is able to set up the Modula Wave on its production line in a very cost-effective and space-saving manner. The modular design played an important part in this regard. No specialised amendments of transport and no alterations to the building were necessary to transport and install the system in the production facilitie. Each module (W x D x H: 750 x 1500 x 1500 mm) was transported individually and could there- fore be conveyed to upper storeys in a nor- mal lift or through smaller gates without problems.
This stands for considerable cost savings compared to conventional systems. The system was configured precisely to our requirements. New components such as additional pre-heating modules can be integrated into the existing system very quickly and simply should these requirements change in the future. This is also possible at any time even after the system has been operated for a certain period of time. The initial investment could be kept low, and the system can be expanded by adding modules at any time if production requirements and additional products demand it. The modules are always constructed according to the same principle and are then simply placed next to each other, aligned and bolted together on the production line. The system is also deliberately designed with a limited range of parts and components. This, of course, simplifies preventive maintenance for staff and keeps the cost of storing replacement parts low.
Attention has also been paid to an energy-efficient design. The solder pot is compact und the soldering pump works according to the stator/rotor principle and thus does without a single moving part. The only thing that moves is the solder. All wearing parts which can cause problems in conventional soldering pumps are therefore immediately dispensed with. For this reason, the Kirsten Jet Wave also needs a significant smaller solder bath than conventio- nal soldering pumps does (just 60 kg). The results are substantially lower energy consumption and a short heating-up time of just one hour.
The low content of the solder pot means that the cost of the capital tied up in solder is also significant lower. One complete filling of the solder pot costs only a fraction of what it does bevor. The formation of waste metal is mini-mised by the compact solder pot and the resulting small, unprotected solder surface which also means that solder consumption is kept low. A very high solder turnover ratio is achieved with a capacity of just 60 kg of solder, which also reduces contamination of the solder bath to an absolute minimum. If the contents of the solder pot still have to be changed, the costs of refilling new solder are minimal.
