Increasingly 3-D solder paste inspection is being implemented to prevent end of line defects before they occur. The majority of all solder related defects can be attributed to paste printing process related issues, and with lead-free processes, smaller components and higher densities, printing challenges are even more difficult. By incorporating the volumetric solder paste inspection available from the AOI system into the SMT line, users can optimize volume, area, position and paste height thresholds and correlate them to the root cause of post-reflow defects. Once characterized, paste deposits that are likely to cause post-reflow defects can be stopped after screening and corrected. At the same time, trend data from the paste inspection stage can be used to correct the screening process parameters that are causing faulty paste deposits.
Symbion P36 Plus is part of Orbotech’s innovative total solution for defect prevention which includes fully integrated Advisor process control software. Manufacturers can now have a holistic view of quality relevant metrics for the entire line from a single source. This includes an easily-accessible central data hub where all relevant SMT quality data including AOI resource information such as programs, inspection results as well as process machine parameters and setup data are stored.
In addition to providing accurate inspection results from the company’s AOI systems, it automatically links post-reflow AOI inspection data with solder paste AOI inspection data and solder paste inspection results with paste printer machine events. Also included is an alarm engine that sends alerts when processes are out of operator-defined parameters and that can stop a related machine if desired. The overall result is easy, cost-effective, real-time information access that manufacturers can use to detect trends that lead to defective boards, correct process machine parameters before defects occur and achieve reduced levels of line DPMO (defects per million opportunities).
EPP Europe 453
