- Full barrel fill that is easily inspected
- No loss of throughput
- Elimination of step stencil with reduced defects at fine-pitch devices
- Reduction of overprint, which eliminated solder beads and balls
- Increased flexibility for future designs
The release of IPC-J-STD-002 Revision F introduces stricter, more precisely defined requirements for solderability testing, including a mandatory automatic flux doctor blade on solderability testers. Equipment lacking…
Plasmatreat's PFW10 and PFW20 static plasma jet systems are designed for selective, high-accuracy surface treatment of sensitive electronic assemblies, including circuit boards, using cold atmospheric-pressure plasma.
Indium Corporation will exhibit three solder paste technologies at Expo for Electronics Manufacturing (EFX) 2026 in Stuttgart, Germany, addressing thermal cycling performance, low-temperature step soldering and…
Europlacer makes the case that traditional SMT software was not designed for the demands of high-mix, short-run production, and that the resulting performance gap is increasingly visible on the shop floor.