Hall 6 will showcase the topics „system development and production preparation“ as well as „materials and components“. In Hall 7, the focus will be on „processes and manufacturing,“ which will also feature in Hall 7A in addition to the topics „reliability and test“ and „software and production control“.
Representatives of approximately 500 companies from Germany and abroad will present the latest developments, applications and trends to visitors.
During the conference, international experts will speak in German about „High frequency components – no bit is left out in processing and transmission“. The topic of discussion on Thursday will be „Technologies for photonic systems – taking over where electricity leaves off“. A total of 17 practice-oriented, half-day tutorials are also on the agenda for Tuesday, Wednesday and Thursday. Delegates will discuss relevant issues spanning the entire value chain of electronic components manufacturing from design to process technology through to quality assurance.
Two conference sessions, two workshops and 17 German and English tutorials concerning all aspects of system integration in microelectronics make up the program at SMT Hybrid Packaging 2015. Special highlight of the event is the Open Source Workshop on Wednesday afternoon dealing with the “Challenges of 3D-IC-Integration for PCB Technologies”. Workshop language is German. Further highlights are the two German conference sessions on Wednesday and Thursday morning with the topics “High frequency assemblies – no bit is neglected during processing and transmission” and “Technologies for photonic systems – where electronics can go no further”.
In addition, the English workshop “Manufacturing the Internet of Things” on Tuesday analyses the influence of Industry 4.0 on electronics manufacturing with insights into the opportunities and challenges for the EMS supply chain.
With the Open Source Workshop on Wednesday, 6 May 2015 in the afternoon, SMT Hybrid Packaging 2015 presents a new workshop concept. Unlike other workshops, all participants actively discuss three different subject areas of the “Challenges of 3D-IC Integration for PCB Technologies”. Each group is supervised by a moderator who guides the time-limited discussions in the respective subject areas. After the show, the results will be summarized and made available to the participants. This workshop aims to provide a platform for topics with open questions and so far no generally accepted solutions. Workshop language is German.
