- Extensive PanaCIM integration
- Simplified product changeovers
- Comprehensive production traceability
- The only Dual Gantry, Multi-Head and Odd-Shape solution with a speed of 4500 comp./hrMany standard head and in-feed options for comprehensive usage areas100 N plug-in force for snap-in, press-fit components, sockets and cable connectors
- The only Dual Gantry, Multi-Head and Odd-Shape solution with a speed of 4500 comp./hr
- Many standard head and in-feed options for comprehensive usage areas
- 100 N plug-in force for snap-in, press-fit components, sockets and cable connectors
- The new NPM-W2S is based on the well-known NPM-W2 platform for applications with large feeder set-ups and smaller batch sizes. The NPM-W2S is the perfect solution for lines with a higher product mixture, which construct complex assemblies or complement the NPM-W2 as a low-cost, flexible production booster.
- High-speed 03015 chip placement and 30 μm @ 1.00 Cpk precisionHigh-performance plug-in capability with up to 100 N for the processing of special componentsCompatible with NPM-W2 single and dual lane PCB handling options
- High-speed 03015 chip placement and 30 μm @ 1.00 Cpk precision
- High-performance plug-in capability with up to 100 N for the processing of special components
- Compatible with NPM-W2 single and dual lane PCB handling options
- PanaCIM is a comprehensive new system-architectural innovative version of powerful manufacturing software, which can grow with the manufacturer and provide full and unprecedented integration in the cloud at the same time.
- The choice of a turnkey single solution provides better control at line and factory levelRapid implementation with minimal infrastructure requirements reduces deployment costsProduct characteristics and capabilities are continuously being further developed by applying standards
- The choice of a turnkey single solution provides better control at line and factory level
- Rapid implementation with minimal infrastructure requirements reduces deployment costs
- Product characteristics and capabilities are continuously being further developed by applying standards
- The Panasonic MD-P300 is a Flip Chip Bonder from the comprehensive IC assembly system product range. The MD-P300 is designed for flip chip bonding, thermosonic bonding and thermocompression bonding.
- A high yield with outstanding throughput + simple conversion of the bonding tools by the user
- The fast bonding speed and high bonding accuracy are achieved by using lightweight bonding heads with a low centre of gravity
- The MD-P300 can process wafers with diameters of up to 300 mm
- Thanks to the integrated camera on the bonding head, an immediate inspection after gluing is possible, i.e. real-time inspection in the manufacturing process
- The MD-P300 can be combined with the SMD placement machines from Panasonic in order to realise chip-on-board hybrid assembly
