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    Startseite/Applications/Artikel
    Small Passive Rework Application Package Offers 5 µm-Placement-Accuracy
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    Applications

    Small Passive Rework Application Package Offers 5 µm-Placement-Accuracy

    The Small Passive Rework (SPR) application package allows reproducible rework results for circuits of 01005 components (size 0.25 mm x 0.125 mm). For such
    Veröffentlicht
    12. April 2006
    Lesezeit
    1 Minute
    Rubrik
    Applications

    All rework steps, viz desoldering, solder removal, dispensing, component pick up and placement, as well as soldering in, are managed within one single machine. The SPR package is a real Fineplacer rework station. But it is also capable not only of reworking small passives, but also BGA, CSP, QFP, TSOP, MLF, QFN and all other recently introduced SMDs. For these applications, the dispenser may also be used with adhesives or underfill.

    www.finetech.de/enid/pico

    EPP EUROPE 426

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