Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Products/Artikel
    Shenmao offers one-step reflow solder paste
    Bildquelle nicht angegeben
    Products

    Shenmao offers one-step reflow solder paste

    Provider of solder products, Shenmao America, has released a Joint Enhanced Solder Paste (JEP) called PF606-EP305 which it says offers the advantages of
    Veröffentlicht
    31. August 2021
    Lesezeit
    1 Minute
    Rubrik
    Products

    The new epoxy-based solder material is designed for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly. It is compatible with various surface finishes, with a transparent residue and no cleaning required.

    Shenmao’s JEP is both lead-free and halogen-free. Halogen can generate hazardous gas at high temperature and the use is restricted. Shenmao halogen-free JEP materials meet J-STD standard (≤1000ppm Chlorine/ ≤1000ppm Bromine) and IEC standard (≤900ppm Chlorine/ ≤900ppm Bromine/ ≤1500ppm Total halogens).

    The company says it strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. Shenmao America blends SMT solder paste at its facility in San Jose, CA for distribution in North America.

    www.shenmao.com

    Mehr aus Products

    Weitere aktuelle Artikel aus der Rubrik Products.

    Alle Products-Artikel
    Heavy board options added to reflow soldering system
    Products

    Heavy board options added to reflow soldering system

    27. Mai 2025

    Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This

    New 3D AXI platform provides clearer imaging
    Products

    New 3D AXI platform provides clearer imaging

    22. Januar 2025

    Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer

    No-clean formula maximize the solderability
    Products

    No-clean formula maximize the solderability

    10. Januar 2025

    Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting

    Extensive program of testing options
    Products

    Extensive program of testing options

    10. Januar 2025

    Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and

    ← Zurück zu ProductsZur Startseite