The new platform checks for the presence of the correct components, the correct orientation or polarity, component colours are recognized and compared. Further inspection tasks include text verification (OCV), orientation and code reading. Circuit boards with a bad mark marking are automatically recognized and not checked.Short cycle times and an assembly size of up to 610 x 510 mm [24” x 20”] guarantee high system efficiency.
To reduce investment costs when there are several workstations, the AssemblyCheck can also be used inline. The combination with the THT-AOI system PowerVision offers maximum ROI: both systems are integrated in just one module that is installed in front of the soldering system.
At the assembly transport level, the new technology checks for correct component placement. Incorrectly assembled circuit boards can be automatically removed from the line, while defect-free assemblies are released for the further process. After the soldering process, the AOI carries out the solder joint inspection at the return conveyor level of the module.
Booth A4.578
