“This latest automated inspection solution … contributes to enhanced quality assurance and increased productivity and is perfect for highest quality inspection of ever-evolving high-density PCB technology,” the company said.
The company will debut the first AOI machine in this new 3Di series at the JISSO PROTEC 2022 show (June 15-17, Tokyo Big Sight International Exhibition Center, Japan, booth 4D-12, East Hall 4-6). The machine configuration will feature a camera resolution of 8 μm, a height measurement range of 25 mm, and an imaging speed of 4,500 mm2/s.
According to the solutions provider, key features of the new series include:
- A newly developed high-resolution camera system that enables:high-resolution inspection of high-density PCBs and ultra-small components.expanded height measurement range.
- high-resolution inspection of high-density PCBs and ultra-small components.
- expanded height measurement range.
- Sophisticated software and hardware configuration that optimizes image processing and achieves the industry’s fastest cycle time.
- An innovative and unique inspection algorithm that enables clear 3D solder joint inspection.
- Scalability with the option to easily modify configurations at any time as required by adding new camera heads, AI functions, and other future features.
Norihiro Koike, President and CEO of Saki Corporation, commented: “Saki’s new 3Di series keeps pace with the rapidly evolving needs of the market and delivers highest inspection quality and accuracy along with the fast cycle times demanded by the next generation of PCB technology. We will continue to develop add-on solutions in the future that will provide a variety of additional optional functions, offer flexibility, and contribute to sustainable manufacturing concepts that that are shaping our customers’ smart factories.”
