The Summit 1800A adds a motor controlled board support table to the standard benefits of the lead free rework system. The new table facilities automated, hands free site scavenging. It also supports automated alignment and further reduces operator intervention.
Various options are available for the rework station, which include component print station, cooling boost, sliding board support, 17” LCD monitor and 22 x 30” board size upgrade.
The company’s windows-based SierraMate 7.0 software improves on the industry-proven simple operation and process control.
Advanced auto profile with rules-based process development allows process engineers to set specific constraints to be applied during automatic profile generation. This is a significant benefit for lead-free processes.
An automatic prism shuttle designed to accommodate large components facilitates accurate and repeatable component alignment. The system simultaneously looks up at the component and down at the board, providing a composite alignment view. The digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a simple click on the graphical user interface.
The rework station incorporates independent, programmable motions for both pick-up and top heater height. The pick-up motion allows precise placement force control and zero force removal. The component pick-up tube features 360° Theta control and automatic alignment height, ensuring proper focus and image magnification of components to be placed. Programmable heater position with automatic height sensing allows the nozzle to gasket the board with minimal force, or to be located at a pre-set gap above the board.
With standard board handling of 18 x 22”, placement accuracy of 0.0005 to 0.001” and magnification capability from 2 to 40 X, the rework station offers users numerous benefits, including advanced thermal data collection and analysis with trend capability, password-protected user accounts, and positive flow control for peak temperature protection of delicate components. Additionally, the system can rework the following applications: MCM, BGA, QFP, CPU sockets, vertical connectors, straddle mount connectors, passive components, microSMD, flip chip, microBGA and CSP.
Nepcon UK, C20 and B11
EPP Europe 451
