The adhesive is a reactive material that can be applied neatly as a liquid melt in very thin, <0.5-mm-wide, bonding lines. It cools quickly and cures at room temperature to become a viscoelastic polymer that provides strong, flexible, primerless adhesion to common plastic and metal substrates.
The material offers extended service temperatures from –40°C to 150°C. It will soften when exposed to high temperatures, but revert to its typical properties after cooling. Unlike conventional polyurethane-based hot melt solutions, EA-4600 Silicone Hot Melt Adhesive incorporates ultraviolet (UV) markers to support automated UV inspection of finished parts. It can also be easily reworked within 24 hours of application. Once fully cured, the adhesive delivers outstanding, durable protection against chemicals, water and dust to enhance the reliability and performance of high-value electronics assemblies.
When designing and assembling smart devices that require narrow bezels and other innovative concepts, the adhesive’s narrow bead width, fast green strength and strong post-cure bond all offer greatly expand options, compared to double-sided tape and conventional thermal cure adhesives. The company’s new product can also enable a 5x improvement in the total cost of ownership vs. double-sided tape, based on 100 million smart phone window bonding operations that incorporate 0.8 mm bezels.
Dow Corning EA-4600 Hot Melt Adhesive is a solventless, one-component, moisture-cure silicone material that offers longer open time and pot life, as well as lower odor and lower levels of volatility compared to conventional organic-based hot melt adhesives. It is available from Dow Corning distributors worldwide.
