Whether it is processing the smallest components, meeting the demand of minimising the void rate of soldered joints, achieving quality improvements thanks to protective lacquer coatings, or ensuring reliable functioning in extreme temperatures, the electronics industry is meeting constant challenges for the processing of sensitive electronic components. Rehm Thermal Systems offers solutions and systems for these needs and will be demonstrating them at productronica in Munich.
The company will be exhibiting the following systems:
VisionXP+: The VisionX series of convection soldering systems represents the highest in quality and flexibility. Its best-in-class model, VisionXP+, offers the high throughput rate and thereby makes convection soldering – with or without vacuum – even more efficient. The continuing development of this system will be presented at the show, including the quieter and more sustainable EC fan motors, the new chamber design which reduces N2 consumption, a newly developed cooling line and several software analysis tools.
Vision TripleX: With the TripleX, a new development for convection and vapour phase soldering will be introduced. It is based on the reflow convection soldering system of the VisionX series and combines the convection soldering process with the vapour phase soldering process of the CondensoX series. As a result, three different processes can be carried out in the Vision TripleX: Reflow convection soldering with or without vacuum and vapour phase soldering with Galden. This not only provides flexibility but also offers an integrated dual lane and thus shorter cycle times and higher throughput.
CondensoXS smart: The process chamber in the CondensoXS smart system delivers high process reliability and still has a small footprint. The new chamber design, which opens and closes vertically, ensures the optimum hermetical seal and thus reliable and reproducible results. This modified opening mechanism has greatly improved both the dependability and the service life of the system.
Nexus: The Nexus vacuum soldering system is suited for cavity-free and flux-free soldering at up to 450°C with a variety of process gases. Wet-chemical activation is optionally available with formic acid. Lead-free or lead-based preforms and pastes can also be used. Contact soldering is principally used for advanced packaging and power electronics applications. The optional vacuum function helps to minimise oxidation in the components and in the joint itself.
ProtectoXP/XC: The selective Protecto conformal coating system protects sensitive electronic modules from damage by corrosion or other environmental influences such as moisture, chemicals or dust. At the heart of the system is a coating management function linked to the nozzle technology. Up to four coating applicators are used, offering a high level of versatility. with ProtectoXC, two processes can be run simultaneously, and with ProtectoXP, four can be run. The ProtectoX systems will be demonstrated at productronica with the ViCon system software. In addition to enabling the use of touch elements and gestures, restructuring the menu items and control interfaces, the key issue in developing this software was to allow for it to be accessed from different types of devices.
RDS UV drying system: Reduced cycle times for the coating process today call for a faster curing time; this can be provided optimally using UV drying plant. The company has created a compact dryer specially designed for the curing of UV coatings and adhesives in the new RDS UV unit. UV coatings are solvent-free and therefore advantageous for processing and for the environment. They are being used more commonly as corrosion protection for electronic components in the automotive industry, but also as diversely as for musical instruments and in the cosmetics and household appliance industries.
productronica, Booth A4–335
