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    Reflow technology for new packaging and high thermal mass assembly
    Foto: Alexandre Debiève / Unsplash
    Products

    Reflow technology for new packaging and high thermal mass assembly

    Rehm Thermal Systems has launched the latest of its high performance vapor phase reflow systems. The CondensoXS reduces floor space by 25% while
    Veröffentlicht
    24. Juni 2013
    Lesezeit
    2 Minuten
    Rubrik
    Products

    Best-in-class energy efficiency is a studied characteristic of all reflow systems from the company and the CondensoX-Series is no exception. And now, this system is also available in a smaller version, saving as much as 25% space, with board loading carried out at the front, underneath the cooling system. As the re-emergence of vapor phase technology continues to pick up momentum, the system’s reflow technology is meeting the challenges of new packaging, lead free conversions and high thermal mass assembly.

    www.rehm-group.com

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