Seho’s convection reflow soldering system FDS MaxiPower is equipped with an energy transfer mechanism, to provide with a triple pea, allowing high flexibility in temperature profile settings. High gas volumes as well as the special shape of the air nozzles make for an ideal heat transfer to the board assemblies, and thus enables an effective and component-sensitive heating. Set-up of low oven temperatures is possible which, especially in lead free processes, is of importance, since the temperature-stress on the components will be reduced to a minimum. Another advantage is the multi-stage flux management system including process gas cleaning. This greatly lowers the required maintenance.
EPP EUROPE 417
