This method integrates UV curing into the machine to bond the assembly without having to transfer to another station and risk causing defects. It uses a clear datum to hold the base substrate and a robotic placement head to perform the assembly.
Additionally, this method includes video display of the dispensing and assembly process. Video/image inspection of the bonded assembly shows defects such as bubbles, voids, dust, foreign particles, scratches, and so on.
Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This
Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting
Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and