- Enable the complete removal of solder balls and flux residues on the HF assemblies to meet the customers’ requirements
- The new cleaning process should be fully automated to match the current and also future production throughput
- Provide easy handling for the operators, improve health and safety situation
- Better cleaning results in terms of complete removal of flux residues and solder ball formations from the HF assemblies due to the optimal combination of agitation system and cleaning chemistry
- Higher throughput possibilities as a result of a fully automated four-chamber cleaning machine
- Easy handling for the operator due to an integrated touch screen menu with full access to all process parameters
