- Touch-membrane in key pads
- Printed coils in RFID systems (Smart Label)
- Creation of conductor lines on rigid and flexible substrates
- Integrated polymer thick-film resistors
- Filling materials for through holes (Via-Plug)
- Repair of PCB’s
- Development of electromagnetic shielding
- Fast, additive process
- Efficient drying process (short with low temperature)
- Cost saving production
- Small material costs
- Environment friendly
- Great variety of substrate materials
- Multilayer ability
- Possible integration of passive components
- Lower conductivity,
- Greater structure sizes and
- Smaller abrasion resistance.
