- Defects from SMT placement-caused misalignment, missing parts, incorrect/wrong parts, bent leads, wrong polarity, extra parts which will lead to opens, shorts and wrong value components during ICT.
- Defects from wave soldering and reflow ovens causing insufficient solders, board flooding, bridging, solder crack, wetting, as well as voiding causing defects such as open and shorts during ICT.
- Defects from the use of manual hand insertion of odd-shaped components, causing bent pins, wrong parts and wrong polarity that result in opens, shorts and wrong value defect during ICT.
- New technology such as high speed signals, high current power requirements, high density interconnects causing failures on ICT such as opens, shorts; as well as loss of test point access which will translate to lower test coverage during ICT and higher failure during functional test, which is harder to repair.
- Strong demand from Electronics Manufacturing Services (EMS), Original Design Manufacturing (ODM) and Original Equipment Manufacturing (OEM).
- Deeply-entrenched ICT business ecosystem, comprising test programming solution, fixturing services, ICT test probes, and software solutions such as CAD translation, DFT, and test coverage analysis)
- Availability of ICT test engineers and ICT system support services at every manufacturing site, worldwide. This represents a veritable pool of engineering human resource.
