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    Potential methods for good solder joint
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    Applications

    Potential methods for good solder joint

    Three ingredients are required to make a good solder joint: solder, clean metal surfaces to connect and heat. In a selective soldering process all three
    Veröffentlicht
    24. April 2014
    Lesezeit
    1 Minute
    Rubrik
    Applications
    • Spreading. In selective soldering the flux should not spread too far. Flux is only required in the soldering area and should remain there only.
    • Inert after soldering. Non-activated flux residues are a potential risk for electro-migration.
    • Flux surface tension (flux type)
    • Surface energy of the board (solder mask)
    • Temperature of the flux
    • Temperature of the board
    • An alcohol flux will spread less when the board is preheated, where a VOC-Free water based flux will spread more when the surface is hot.
    • Due to the minor spreading the solid content left per cm² is much more for a VOC-Free flux and less for alcohol based.
    • Open time drop-jet (500 – 2500ms)
    • Frequency drop-jet (10 – 300Hz)
    • Speed of the flux robot (10 – 150mm/s)
    • 1.) “Performing Flux-Technology for Pb-Free SN100C Solders”, Apex 2010, Ineke van Tiggelen-Aarden, and Eli Westerlaken, Cobar Europe BV
    • 2. ) “How PEDOT:PSS solutions produce satellite-free inkjets”, Stephen D. Hoath, SungjuneJunga, Wen-Kai Hsiaoa and Ian M. Hutchingsa, Department of Engineering, University of Cambridge

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