The solution enables post saw testing of singulated WLCSPs detecting all production defects in true final test of singulated devices. In addition, the same process can be deployed for retest and RMA process handling. Both options significantly enhance the production quality of the shipped devices and support the zero defect parts per million (ppm) efforts of the device makers. It is also equipped with a full 6 side vision inspection capability for complete physical validation.
InWaferX combines high multisite testing with the highest positioning accuracy for best yield and 100% touch efficiency on the rectangular carrier trays. It supports the high daily output requirements in today’s high volume manufacturing (HVM) environments. Based on the well-established InCarrier / InStrip solution, this supports full range temperature testing, as well as, MEMS/sensor testing. The final test solution can be applied for WLCSPs from sawn film frame or tape and reel.
Andreas Bursian, Senior Director Innovation, comments: “We did extensive system validation on a production test floor and passed all requirements such as ESD, safety and operational conditions. Compared to the traditional wafer probing, the InWaferX test solution has proven to increase test throughput and outgoing device quality.
