Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Technology/Artikel
    Plasmatreat PFW10 and PFW20 Static Plasma Jets Target Sensitive PCB Surface Treatment
    Foto: Johannes Plenio / Unsplash
    Technology

    Plasmatreat PFW10 and PFW20 Static Plasma Jets Target Sensitive PCB Surface Treatment

    Openair-Plasma systems offer potential-free pretreatment for circuit boards and precision components
    Veröffentlicht
    28. Oktober 2026
    Lesezeit
    1 Minute
    Rubrik
    Technology

    Plasmatreat offers two static Openair-Plasma jet series — the PFW10 and PFW20 — for industrial surface pretreatment applications. Both systems generate cold plasma via high voltage between a stator and rotor inside the jet head, with working gas used to direct plasma onto the substrate. The potential-free design ensures no voltage transfer to the workpiece, making the systems suitable for sensitive electronics such as printed circuit boards.

    The PFW10 is positioned for high process speeds, high-energy treatment, and selective application — for example, treating a specific bonding groove on a component. The PFW20 complements this with a broader treatment profile. Plasmatreat supports more than 50 jet head variants with differing outlet angles, allowing tuning to specific substrate geometries. An optional 90° cable connection is available for space-constrained integration scenarios.

    In electronics manufacturing, atmospheric plasma pretreatment is used ahead of dispensing, conformal coating, and adhesive bonding processes to improve surface energy and adhesion. Plasmatreat's static jet portfolio addresses applications where rotating plasma systems — better suited to wider surface areas — would be excessive or impractical.

    Quelle: Plasmatreat (semicon) – https://www.plasmatreat.com/en/products-and-services/openair-plasmar-jets/static-jets-pfw10-and-pfw20

    Mehr aus Technology

    Weitere aktuelle Artikel aus der Rubrik Technology.

    Alle Technology-Artikel
    IPC-J-STD-002F mandates automatic flux doctor blade for solderability testingFoto: Louis Reed / Unsplash
    Technology

    IPC-J-STD-002F mandates automatic flux doctor blade for solderability testing

    10. November 2026

    The release of IPC-J-STD-002 Revision F introduces stricter, more precisely defined requirements for solderability testing, including a mandatory automatic flux doctor blade on solderability testers. Equipment lacking…

    Indium Corporation to Present High-Reliability Solder Pastes at EFX 2026 in StuttgartFoto: Indium Corporation
    Technology

    Indium Corporation to Present High-Reliability Solder Pastes at EFX 2026 in Stuttgart

    30. September 2026

    Indium Corporation will exhibit three solder paste technologies at Expo for Electronics Manufacturing (EFX) 2026 in Stuttgart, Germany, addressing thermal cycling performance, low-temperature step soldering and…

    Europlacer: Software as the Core Performance Driver in High-Mix SMTFoto: Brecht Corbeel / Unsplash
    Technology

    Europlacer: Software as the Core Performance Driver in High-Mix SMT

    24. September 2026

    Europlacer makes the case that traditional SMT software was not designed for the demands of high-mix, short-run production, and that the resulting performance gap is increasingly visible on the shop floor.

    Europlacer Addresses Solder Paste Printing Variation in HMLV Electronics ProductionFoto: Anne Nygård / Unsplash
    Technology

    Europlacer Addresses Solder Paste Printing Variation in HMLV Electronics Production

    23. September 2026

    Europlacer has published a technical paper arguing that process variation in solder paste printing represents a disproportionate quality and cost risk in high-mix, low-volume electronics manufacturing, where small batch…

    ← Zurück zu TechnologyZur Startseite