The new CP20P2 placement head is at the core of the improved Siplace TX. Thanks to further technological improvements, developers were able to increase the placement performance of the new head by more than 23 % from 39,000 to 48,000 cph. They also installed a component camera with improved resolution and larger vision field, better component sensors, and a more robust contactless data and power transmission system.
Equipped with two of the SpeedStar placement heads, the Siplace TX can place up to 96,000 components per hour in sizes ranging from 0201 (metric) to 8.2 x 8.2 x 4 mm. Despite the significant speed increase, it still operates with exceptional accuracy rated at 25 μm @ 3 sigma – just like the preceding version. The placement force can now be reduced to as little as 0.5 N in order to place sensitive components even more gently than before. And the new placement head suspension allows significantly easier and faster head changeovers – for example, to the highly flexible MultiStar.
More flexibility
To take full advantage of the new model‘s performance, components are supplied via the Siplace SmartFeeder Xi feeders with faster and more accurate transport systems or the new Siplace BulkFeeders X, whose cartridges can hold up to 1.5 million components in bulk. In addition, special options like the Siplace Smart Pin Support and the Long Board Option for boards with lengths of up to 510 mm will also be available.
All of this is good news for electronics manufacturers who already operate the modules on their lines. Since current and new models are based on identical components (with two exceptions), spare parts logistics will be mostly unchanged. The company will switch its global shipments to the improved modules in the winter of 2018. The solution is aimed at demanding high-volume manufacturers in Europe, North America, South America, and Asia.
