The aim of these Moulded Interconnected Devices (MID) is to gain design freedom, rationalize the production process and increase environment protection by reduction of the material mix.
For maximum room use MID are designed in three dimensions (3D-MID), where components must be placed in different height and in different declination. This enables to increase the functional density in products. Essemtec has developed a machine concept for such production based on a highly flexible inline pick & place FLX2011-LCV. The placer is completed by a palette transport system, a five axis robot and a special dispensing head with 2 valves. The free motion robot arm is located in the chassis of the pick & place. It grips the 3D-MID module from the transport system and positions it in the required position and declination for dispensing and placement.
The special dispensing head is equipped with two individual touch-less dispensers, one for the precise dispensing of solder paste, the other for the accurate metering of fast curing adhesive. Solder paste is applied to the electrical contact surfaces.
Glue is dispensed on other locations to fix the SMD part until the reflow process and to absorb mechanical stress during the lifetime of the product. After dispensing the SMD components are placed as usual with a vacuum tool. They are picked from feeders, measured and aligned by an optical centring system and then placed to the contact surfaces.
Standard components are aligned on-the-fly with a laser system, for BGA, QFN and QFP a Cognex Vision system is used. When all SMD parts are in place, the robot arm grips the MID module and handles it to the transport system which leads it to the reflow process. The complete production cell is controlled by the pick & place which communicates with the robot and the transport system via an interface. Programming can be done by importing CAD data or by a teach-in process using the video camera integrated in the pick & place head.
EPP Europe 511
