Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Applications/Artikel
    Pick-and-place system for high-mix/low-volume production
    Bildquelle nicht angegeben
    Applications

    Pick-and-place system for high-mix/low-volume production

    The FLX2010-LCV from Essemtec is a flexible pick-and-place system designed for high-mix/low-volume production. Speed and throughput are interesting: In
    Veröffentlicht
    12. April 2007
    Lesezeit
    2 Minuten
    Rubrik
    Applications

    The modular system features a large feeder capacity – up to 310 feeders, graphical control software, inventory control and traceability, and changeover without downtime. Easyplacer is the powerful man-machine interface of the pick-and-place system. For easy operation, all information is displayed graphically. Complex coordinate lists are quickly converted into a clear virtual view of the PCB, which operators can understand and control. The Easyplacer software is easy to learn and designed to fulfill both operator and programmer expectations. In a high-mix production, the changeover is the most important cost factor.

    According to the company, with the FLX concept, changeover cost and time can be minimized. Offline production preparation and programming, in combination with intelligent feeders and a large feeder capacity, allow a product changeover with no downtime. Placing only chips and ICs from tape, stick and tray is not enough in a high-mix environment. Therefore, the pick-and-place system can accept nearly any kind of feeding system. Even an independent unit can be used as a feeder, such as a vibratory bowl feeder for bulk components with no electrical connection to the machine. The feeder flexibility enables customer-specific applications far beyond standard placement.

    The system is equipped with a combination of different alignment systems: laser and vision. Together, they provide advantages for both chip shooting and ultra-fine-pitch placement. Vision systems can be upgraded at the customer site if the production requirements change.

    SMT, hall 7, booth 203/ Nepcon UK E40, A44

    www.essemtec.com

    EPP Europe 443

    Mehr aus Applications

    Weitere aktuelle Artikel aus der Rubrik Applications.

    Alle Applications-Artikel
    Expert to highlight new solder paste in Rosemont
    Applications

    Expert to highlight new solder paste in Rosemont

    25. August 2025

    AIM Solder is participating in the upcoming SMTA International 2025 event, which is taking place from October 19–23 at the Donald E. Stephens Convention

    Selective soldering machine take production to a new level
    Applications

    Selective soldering machine take production to a new level

    27. Mai 2025

    Under the motto “Assembling the Future”, Phonotronica Ltd. has been a pioneer in the development and manufacture of electronic modules since 1990.

    ← Zurück zu ApplicationsZur Startseite