Indium Corporation will feature Indium11.8HF-SPR solder paste – an air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC Apex Expo 2018, Feb. 24-March 1 in San Diego, California.
This solder paste specifically addresses customers’ needs for Type 5 powder. It delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance.
Benefits include:
- Halogen-free per IEC 61249–2–21 test method EN14582
- High-transfer efficiency through small apertures (≤ 0.66AR)
- Long stencil life ( 12 hours)
- Eliminates hot and cold slump to inhibit bridging and solder beading defects
- Avoids the potential for HIP and graping defects with a unique oxidation barrier
Apex, Booth 1625