UK-based manufacturer of electrically and thermally conductive materials, Parker Chomerics (a division of Parker Hannifin) has announced the launch of a 7.5 W/m-K single component dispensable thermal interface material called THERM-A-GAP GEL 75, designed for high performance applications. When applied to a heat generating component, the gel provides minimal stress and pressure due to its low compression force and represents the highest thermal conductivity dispensable available from Parker Chomerics. Its flow rate is nearly three times faster than the next closest performing material in the THERM-A-GAP family, the company stated in a press release.
The new gel is best suited for high volume, automated production, specifically found in telecommunications equipment, automotive safety electronics modules, power supplies, and memory and power modules, Parker Chomerics explained.
“GEL 75 was formulated to accommodate the future high-power demands of many different markets, including 5G enabled telecom infrastructure, automotive applications — any application that is seeing increased bandwidth demands that generate excessive heat,” said Global Thermal Business Unit Manage at Parker Chomerics, Brian Mahoney. “It is the next evolution in our THERM-A-GAP gap filler family of easy to use, reliable, high performance, single component dispensable gels.
“The opportunity for automation is a significant advantage for THERM-A-GAP GEL 75 over thermal gap pads because gel dispensing systems allow for support of multiple size and thickness requirements with a single system configuration. While thermal gap pad placement can be automated to an extent, the equipment and fixturing required to do so is typically quite specialised and may not be readily adapted from one job to another.
The company confirmed that the new gel is available globally in different sizes of syringes, cartridges, and pails.
