It is an epoxy resin-based adhesive filled with aluminium oxide. It is a one-component adhesive and due to its flow characteristics, it can be applied by dispenser, screen printing or spatula.
Since Elecolit 6607 cures at low temperatures, even heat-sensitive components can be bonded together. Curing at higher temperatures will shorten the curing time.
After curing, the light gray adhesive insulates electrically and provides excellent heat dissipation. Due to its properties, it is particularly suitable for bonding metal components and heat sinks to electronic circuit boards.
The ability of an electronic or electrical component to dissipate heat has a direct impact on its reliability and longevity. Heat dissipation can be improved in many component assembly applications by incorporating thermally conductive adhesives as bonding agents. Thermally conductive adhesives will channel heat from the bonded component to the attached substrate that functions as a heat sink or dissipater. Electrically conductive materials with metallic fillers are excellent at conducting heat due to their metal content. However, this also creates electrical conductivity, which may or may not be desirable. If only thermal conductivity is needed, non-metallic filled products should be utilized.
Company contact
Panacol-Elosol GmbH
Daimlerstrasse 8
61449 Steinbach/Taunus Germany
Tel.: +49 6171 6202 0
E-Mail: info@panacol.de
Website: www.panacol-usa.com
Also of interest:
UV adhesive from Panacol has low halogen content
