The company says its infrared systems can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD’s. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the system does not require nozzles. A newly-developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. “A Sodr-Cam Reflow Camera comes as a standard allowing the user to watch the entire reflow process in real time,” the company explained. The newly-designed Windows-based software makes profiling simple for even the most advanced applications, it added, “providing intuitive set-up, multistage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage and much more”.
“The Closed-Loop, Non-Contact IR Pyrometer monitors and controls the ramp-rate and temperature of the component in real time, by controlling the top and bottom heaters’ output throughout the reflow process.”
The system includes 1550 Watts of total power. It can rework PCBs up to 12” x 12” (305 mm x 305 mm) and includes a 1000-Watt bottom side pre-heater with an adjustable height of 1.5” (38 mm).
