BTU International, Inc., a supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced plans to introduce its new TrueFlat technology, an optional configuration of the Pyramax convection reflow oven.
Designed for substrate thicknesses of 0.15 to 0.30 mm, this technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to the convection reflow oven’s closed-loop convection heating.
This technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with the company’s proprietary Wincon Windows-based software including factory host/MES interface for Industry 4.0 compliance.
Joe Yang, the product manager, commented, “Pyramax with TrueFlat technology is a factory-ready solution to end die tilt. It simplifies process transfer and maintenance, and provides a perfectly uniform and repeatable thermal process as well as flatness control.”
