Samsung Techwin’s flexible odd-form component placer CP55 is suited for flip-chip processing and pin-in-paste technique. The machine features programmable force control between 0.5 and 30 N, at a placement accuracy of 20µm at 3-sigma. The flying vision system is specified for 9,800cph (4,500cph for QFPs) according to IPC specs. The system accommodates PCB sizes up to 510 x 460mm. It is suited for processing component sizes from 0201 to 75mm square at up to 25mm height and connectors up to 150mm. Feeder capacity with 8mm feeder is 104 tracks. Also from Samsung is the flexible odd-form placer CP45FV Neo with flying full-vision system and a placement speed of 14,900cph.
EPP EUROPE 434
