Information exchange took centre stage as a diverse forum programme including specialist presentations, panel discussions and product presentations spotlighted subjects including sustainability, obsolescence management and AI in electronics manufacturing. German industry organizations including FED e.V., and trade associations VDMA and ZVEI provided the latest industry data in the fields of mechanical engineering and semiconductors.
Other highlights included the ‘Future Packaging’ production line put together by Fraunhofer Institute for Reliability and Microintegration (IZM), and featuring the input of over 70 partner companies. Interested parties were able to attend guided tours of the line with in-depth commentary on each system featured.
At the EMS Park area, ‘best practice lectures were held to facilitate exchanges between OEMs and EMS service providers. The SMTconnect hand-soldering competition, organized by IPC, once again saw soldering professionals showcas their speed and precision in front of an enthusiastic audience.
The event was co-located with PCIM, an international exhibition and conference for power electronics, which brought together 507 exhibitors and over 16,500 visitors, according to organizers.
The next SMTconnect will be held in Nuremberg, Germany, June 11–13, 2024.
