Cyber Technologies’ Vantage system is a high-resolution, laser-based, non-contact inspection system for quickly measuring height and thickness of dispensed materials such as solder paste or thick films. Also warpage or parallelism, angles, length, width, and many other parameters of features can be verified. A key strength is that it is unaffected by shiny, translucent or multicolored surfaces. The instrument’s digital sensor technology automatically compensates for variations in surface reflectivity. As a result, the Vantage delivers consistently accurate readings across a wide range of objects from shiny solder bumps to coarse inks and solder-paste deposits. Its non-contact height measurement system employs digital laser sensors and computer-controlled motion to produce high-resolution 2D profiles and 3D raster scans which then produce a 3D topographical map. These non-contact inspections are required for micro-scale objects that may be wet, fragile, bendable or highly contoured. The sensors are available with different resolutions and measurement ranges for various applications. The video camera displays a magnified view of the measurement location. And the stages are equipped with highly accurate ceramic finger drives and linear encoders to further enhance its technology. Inspection tasks can be completely automated and results stored for further analysis or send to a database or SPC system.
EPP EUROPE 459
