The Heraeus Circuit Materials Division’s F 10 is a high-performance, no-clean L solder paste with reportedly exceptional solderability and printability.
The paste delivers significant reductions in defect rates and improves process yields in comparison with other no-clean solder alloys. Beta testing has demonstrated higher first-pass yields. Independent laboratory testing has qualified F10 as an L no-clean solder paste. The paste claims to provide unparalleled air reflow wetting on difficult surface finishes. A proprietary blend of high-performance activators enables the paste to produce complete fine-pitch pad coverage after reflow with as little as 50 % pad coverage before reflow on leading OSP board finishes. It also eliminates hot slump, which can lead to solder defects. The F10 flux system ensures fine-line printability with high aperture release efficiency. It produces brick-like deposits on all surface topographies, including HASL, thick mask and legend. F10 is capable of high-speed printing and features low solder-void formation and a pin-testable clear flux residue.
EPP EUROPE 415
