Low temperature soldering materials
The company says its series of low temperature soldering materials has been designed to address the industry’s goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139°C while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag.
High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designed for Bi alloys. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C. Additionally, TempSave B37 is available as a flux cored wire.
Solder paste
SN100CV P608 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver- containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, it gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the SN100CV alloy matches the strength of SAC305 while maintaining a high level of resistance to impact loading.
LF-C2 is a high reliability lead-free alloy as it uses both dispersion and solid solution strengthening. With a liquidus temperature of 213°C it can be reflowed at a lower temperature than SAC305.
The P608 flux medium provides wetting comparable with that of halogen containing paste even though it is completely halogen-free. SN100CV P608 and LF-C2 both deliver excellent performance over a wide range of component types and process parameters.
Booth 3301, SMTA International
