DEK’s Galaxy micron-class printer platform for semiconductor packaging and next-generation assembly applications embodies fresh features as well as remote real-time machine management. This launch will be accompanied by complete ball-placement line capable of the positioning of 0.3mm diameter solder balls in area-grid arrays for chip-scale packaging at wafer and substrate levels. High-level software for this platform reportedly reinvents the man-machine interface and adds important automated communication features to enhance management and maintenance of the machine. The software will also be available on platforms throughout the DEK range, including the Typhoon and Viking-class ranges that target specific SMT assembly sectors. With these technologies, the company is opening a path to the e-printer, internet-capable and managed through a connected relationship between the user and the supplier’s service infrastructure.
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