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    Next-generation in-line solder paste inspection system
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    Products

    Next-generation in-line solder paste inspection system

    With more than 1,600 installations, Parmi, a world leader in 3 dimensional inspection of printed solder paste on PCBs, announces that it has been awarded
    Veröffentlicht
    25. März 2013
    Lesezeit
    1 Minute
    Rubrik
    Products

    The system inspects pads smaller than 01005 and sizes as small as 100um. The HS70 inspection cycle time has been greatly reduced by Parmi’s development of the RSC-6 sensor. Furthermore, the RSC sensor delivers 0.42 to 0.6x magnifications providing more control to the engineer.

    The innovative laser measurement head uses a method called optical triangulation to measure the height, area and volume of each pad. The RSC6 laser sensor head uses two laser beams coming from opposite angles (dual laser) to completely eliminate the effect of shadows on the measurement data (zero shadow effect). This, combined with the developed Multiple Profile Correction technology; creates detailed and accurate color 3D images of every pad far surpassing its competitors.

    www.parmi.com

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