OT2 is Cobar’s latest solder paste technology that is specially developed to meet continuously increasing customer requirements. The solder paste’s optimized rosin based chemistry offers the best printing and wetting properties in Pb-free as well as SnPb. Because of the uniform paste flux technology for SnPb and Pb-free, it is easy to switch from SnPb to Pb-free. The solder paste is designed to achieve printing speeds up to 250 mm/s for the most demanding throughputs. The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speeds and short cycle times.
Balver Zinn and Cobar offer solder bar, solder wire, solder flux, gel flux, cleaner and solder paste.
www.balverzinn.com or www.cobar.com
Solder paste OT2
