Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Products/Artikel
    SEHO says new software halves cycle time
    Bildquelle nicht angegeben
    Products

    SEHO says new software halves cycle time

    Manufacturer of soldering process solutions, SEHO Systems, has announced that its new software component known as SmartSplit cuts cycle time by 50% for
    Veröffentlicht
    30. Mai 2022
    Lesezeit
    1 Minute
    Rubrik
    Products

    With the appropriate sensors in the soldering system, the newly-developed software component can control and coordinate the process flow for different assemblies in mixed production, the company explained. “An efficient system for batch production becomes an innovative selective soldering system for high-mix-high-volume production, without conversion and with minimal costs,” the manufacturer said.

    “SmartSplit automatically distributes the various process tasks such as flux application, the soldering process with up to six soldering units and brushing process to the process stations available in the individual system, and thus enables cycle times to be cut in half from a quantity of one to large-scale production. The total processing time for the individual assembly is automatically minimized by the software. At the same time, the process stations do not restrict each other, so that the entire work area can be used.”

    According to the company, the new software is of particular advantage for electronics manufacturers that process a large range of assemblies or produce a large number of product variants. Regardless of whether small or large quantities are produced, the software automatically ensures the most efficient use of the selective soldering system.

    Only the entire soldering task has to be programmed for an assembly and the software automatically distributes it to the existing process stations. The new software can be integrated into the existing SEHO selective soldering systems SelectLine-C and LeanSelect-plus.

    www.seho.de

    Mehr aus Products

    Weitere aktuelle Artikel aus der Rubrik Products.

    Alle Products-Artikel
    Heavy board options added to reflow soldering system
    Products

    Heavy board options added to reflow soldering system

    27. Mai 2025

    Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This

    New 3D AXI platform provides clearer imaging
    Products

    New 3D AXI platform provides clearer imaging

    22. Januar 2025

    Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer

    No-clean formula maximize the solderability
    Products

    No-clean formula maximize the solderability

    10. Januar 2025

    Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting

    Extensive program of testing options
    Products

    Extensive program of testing options

    10. Januar 2025

    Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and

    ← Zurück zu ProductsZur Startseite