- SMT – Adaptation to substrate surfaces and complex structures: The elastic characteristics of the stencil allow for the printing of substrates with significant surface waviness, which cannot be printed using conventional stainless steel stencils. Applications include extreme multilayer substrates that display variations in thickness and height after pressing. The elastic sealing properties of the stencil are significantly enhanced by the additional coating. As a result, this process can be used for compensating local height variations. With the extended design options offered by the M-TeCK stencil, it is possible to print closed frames and other complex structures. For example, printing of a closed paste frame ensures optimal wetting of HF frames.
- Solar cell printing: Thanks to its special characteristics, the M-TeCK stencil allows printing of fine lines with an optimal cross-section for the power line. With the high positioning accuracy, promising processes such as selective emitters can be implemented efficiently.
- Hybrid technology – Fine lines and even surfaces: Thanks to the complex freedom of design, it is possible to produce layouts with fine lines and large areas. Low or high film thicknesses can be produced for print areas and unlike in screen printing, this can be implemented in a single printing process. Significant process improvements and time savings can be achieved in particular for high power applications.
