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    Startseite/Boundary-scan/Artikel
    New high thermal conductivity RTVs on display at productronica
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    Boundary-scan

    New high thermal conductivity RTVs on display at productronica

    Leading electro-chemical manufacturer Electrolube has expanded their thermal management range by creating two new high specification, single component
    Veröffentlicht
    14. September 2009
    Lesezeit
    1 Minute
    Rubrik
    Boundary-scan

    TCER and TCOR are low in odour and cure upon exposure to atmospheric moisture. These RTVs are designed to fill the gap between the device and the heat sink and thus reduce thermal resistance at the boundary between the two. They can be applied around components such as capacitors and power resistors to dissipate excess heat to heat-sinks, avoiding any overheating and subsequent failures. Electrolube features the new products at this year productronica show (hall A4, stand 271).

    www.electrolube.com

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    Mehr aus Boundary-scan

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    Boundary-Scan: How IEEE 1149.1 Enables Structural Board Test Without Physical Probe AccessFoto: Alexandre Debiève / Unsplash
    Boundary-scan

    Boundary-Scan: How IEEE 1149.1 Enables Structural Board Test Without Physical Probe Access

    8. November 2026

    As component densities rise and physical test access on PCBs shrinks, boundary-scan testing based on IEEE Std. 1149.1 has become an indispensable structural test method in electronics manufacturing. This article…

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