Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Boundary-scan/Artikel
    Increasing test coverage with collaboration between two suppliers
    Bildquelle nicht angegeben
    Boundary-scan

    Increasing test coverage with collaboration between two suppliers

    The supplier collaboration helps to address the challenges facing engineers and creates test solutions for the future
    Veröffentlicht
    16. Juni 2017
    Lesezeit
    2 Minuten
    Rubrik
    Boundary-scan

    XJTAG, a supplier of boundary scan technology, and Flying Test Systems, a provider of electronic test solutions in the UK and Ireland, announced the supplier collaboration, with the signing of a joint Technology Partner Agreement.

    Flying Test Systems, offers electronic circuit board test and repair services, design for test (DFT) consultancy services along with in-circuit, SPEA flying probe and bespoke functional test equipment for production.

    Commenting on the agreement, Nigel Priest, Managing Director of Flying Test Systems, says: “Test engineers face increasing pressure with devices that have little or no access to their pins, and space for test points is under pressure. At Flying Test Systems, we are constantly looking out for the best test solutions for our clients and found that XJTAG boundary scan offers great functionality that is priced competitively, user-friendly and comes with a flexible licensing model.”

    XJTAG has been working with a variety of test solution providers, including flying probe vendors, in order to offer the best-in-class test capability and value for clients. Ensuring continuous DFT improvement and that testing ball grid array (BGA) devices on dense boards does not impact test coverage now means combining JTAG boundary scan, bed-of-nails and flying probe machines to achieve the best results. Powerful and easy to use, integrated testing enables engineers to minimise test time while maximising test coverage by using boundary scan.

    Simon Payne, CEO of XJTAG, says: “We are delighted to be working closely with Flying Test Systems and to have them as a Technology Partner. They have a large installed base of clients across defence, aerospace, automotive, medical, industrial & semiconductor throughout the UK. Flying Test Systems understand the day to day challenges of test and can help find the right solution for testing electronics.”

    As electronic circuits become more complicated, the collaboration between suppliers is not only helping address the challenges facing engineers today, but is also creating test solutions fit for the future.

    www.xjtag.com and www.flyingtest.co.uk

    Mehr aus Boundary-scan

    Weitere aktuelle Artikel aus der Rubrik Boundary-scan.

    Alle Boundary-scan-Artikel
    Boundary-Scan: How IEEE 1149.1 Enables Structural Board Test Without Physical Probe AccessFoto: Alexandre Debiève / Unsplash
    Boundary-scan

    Boundary-Scan: How IEEE 1149.1 Enables Structural Board Test Without Physical Probe Access

    8. November 2026

    As component densities rise and physical test access on PCBs shrinks, boundary-scan testing based on IEEE Std. 1149.1 has become an indispensable structural test method in electronics manufacturing. This article…

    ← Zurück zu Boundary-scanZur Startseite