In these application fields, the cleaning agent has two main advantages. On the one side it shows an excellent performance in deoxidation of copper surfaces when it comes to clean power electronics e.g. power modules. The solution provides residue-free, activated copper surfaces and thus ensures optimum preconditions for subsequent processes such as wire bonding, moulding or adhesive bonding. On the other side it convinces with its very good cleaning performance on PCBs, especially at low-standoff components.
The new cleaning agent is based on the MPC technology and has an excellent material compatibiliy because of its pH neutral formulation. It has no flash point, does not foam and thus can be applied in all common spray-in-air equipment without explosion proof.
