The wire bond pull test
The wire bond pull test is a critical method used to assess the quality and integrity of wire bonds in microelectronics. Leveraging extensive historical data, the company‘s manufacturing engineers developed a robust random sampling methodology that ensures testing efficiency without compromising quality. The new sampling plan has reduced average testing time from 2.5 hours per assembly to approximately 1 hour per assembly.
This process is fully compliant with the requirements of MIL-PRF-38534 and MIL-STD-883 and has been implemented on mission-critical, high-frequency RF assemblies — products recognized in the industry as highly complex and challenging to manufacture.
“Achieving greater than 99.99% production yields is a remarkable milestone,” said Daniel De Haro, General Manager of the NEOTech Chatsworth site. “But our team didn’t stop there. They went above and beyond to implement innovative sampling techniques and streamline testing processes to significantly improve production cycle times. I’m incredibly proud of our engineers, technicians, and manufacturing teams for their dedication to excellence and their commitment to setting new benchmarks in microelectronics manufacturing.”
The transition to a sample-based testing methodology was supported by enhanced data collection and analysis, as well as the development of comprehensive training procedures. These efforts ensured that the team could maintain its yield rates while increasing throughput and efficiency for its customers’ microelectronics circuit assemblies.
The transition to a sample-based testing methodology was supported by enhanced data collection and analysis, as well as the development of comprehensive training procedures.
