MVP will be exhibiting at Booth 739 at the IPC Apex Expo 2022 in the San Diego Convention Center between January 25–27.
“Today complex assemblies are becoming more prevalent in the Electronics Industry; It is becoming more common to have multi-height assemblies with SMT, Die, Wirebonds on the same substrate.” said Dr. George T. Ayoub, President of MVP. “Equipped with excellent resolution sensors the Versa and 900 platforms are both capable to do an excellent job in Inspection and Metrology across all the Applications. In addition, MVP’s new 8.0 software release unifies the inspection and metrology capabilities across 2D and 3D sensors in one user-friendly quick set-up interface. Combined with the MVP AutoData suite of Software, both platforms are equipped to assist the customer with traceability and to play a critical role in process control, yield and performance improvement.”
“MVP has aded key automation options on these platforms, equipping them with 2D/3D sensors like high resolution, high Megapixel cameras, Line profilers and Microscope cameras,” Dr. Ayoub added. “In addition, the platforms can be augmented with Magazine loaders, Wafer handling robots/ loaders, Stack loaders, Vacuum supports and other Material Handling options, making the 900 and Versa series the most versatile in the SMT and back-end Semiconductors markets. With these capabilities, MVP ensures that the Quality is always Elevated for its customers over a broad range of Applications and Industries.”
