The system is engineered to deliver inspection capabilities through dual technologies. For topside package inspection, the system features high-resolution telecentric optics, enabling precise measurement of device dimensions, inspection of part markings, and thorough surface examination. For the underside inspection of balls and leads, shadow-free 3D technology ensures accurate coplanarity and positional measurements.
The Aurora employs a Pick-Inspect-Sort methodology for comprehensive multi-sided package inspection. After inspection, defective parts are placed in a defect tray, while good parts are returned to their original tray. This process ensures that the stack of parts loaded for inspection contains only devices that have met all inspection criteria.
The system is able to inspect a wide range of package types including: Ball Grid Arrays (BGAs), Quad Flat Packs (QFPs), Thin Quad Flat Packages (TQFPs), Chip Scale Packages (CSPs), Wafer-Level Packages (WLPs), Quad Flatpack No-Leads (QFNs), Bump Chip Carriers (BCCs), Land Grid Arrays (LGAs), and more. This makes it an ideal solution for both Outgoing Quality Control (OQC) and Incoming Quality Control (IQC).
Software
The company says its ePro software facilitates rapid and efficient recipe development, guiding users through the program generation process to quickly create inspection strategies for various devices.
Traceability
The Aurora system supports SECS/GEM with SEMI E142 mapping and offers MVP‘s End Lot Summary Reports (ELSR) for exporting tray data.
visionpro.com
