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    MRS sensor Technology for 3D AOI systems
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    Products

    MRS sensor Technology for 3D AOI systems

    CyberOptics will display an advanced ultra-high resolution MRS sensor for the company’s SQ3000 3D Automated Optical Inspection (AOI) system
    Veröffentlicht
    04. April 2017
    Lesezeit
    1 Minute
    Rubrik
    Products

    CyberOptics Corporation, a developer and manufacturer of high-precision 3D sensing technology solutions, will display an advanced ultra-high resolution Multi-Reflection Suppression (MRS) sensor for the company’s SQ3000 3D Automated Optical Inspection (AOI) system at the upcoming SMT Hybrid Packaging, scheduled to take place May 16–18, 2017 at the Messe in Nuremberg, Germany.

    The company has advanced the proprietary Multi-Reflection Suppression (MRS) sensor to an even finer resolution. The ultra-high resolution MRS sensor will be an option available for the award-winning SQ3000 3D Automated Optical Inspection (AOI) system. This sensor enhances the SQ3000 3D AOI platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications where an even greater degree of accuracy and inspection reliability is critical.

    “The Ultra-High Resolution MRS sensor enables an even greater degree of accuracy that will provide our customers superior inspection performance and reliability to address the finer 0201 metric and micro-electronics applications,” said Dr. Subodh Kulkarni, the President and CEO. “This advancement will enable CyberOptics to further penetrate these market applications that have the most stringent requirements.”

    The SQ3000 3D AOI system maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneously and in parallel, accelerating 3D inspection speed versus alternate technology. The proprietary MRS sensor technology with the highly sophisticated 3D fusing algorithms offers microscopic image quality at production speeds.

    The company’s CyberGage360 3D Scanning and Inspection system and SE600 SPI system will also be demonstrated.

    SMT Hybrid Packaging, Booth 4–101

    www.cyberoptics.com

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